The preparation of Ni-plated polystyrene microspheres using 3-(trimethoxysilyl) propyl methacrylate as a bridging agent

This study focuses on the preparation of Ni-plated polystyrene (PS) microspheres (diameter 3.7–4.5 μm). These Ni-plated PS microspheres have core–shell structures that were designed and prepared using an organic polymer core (PS with 3-(trimethoxysilyl) propyl methacrylate (TSPM)) and an inorganic metal (Ni) plated shell. The polymer microspheres were synthesized by dispersion copolymerization, and the metal shell was then added by electroless plating. To improve the adhesion between the organic polymers and the inorganic metal, a silane bridging agent (TSPM) was used, which was copolymerized with the styrene monomer and modified the PS microsphere surface. Characterization of the Ni-plated PS microspheres was undertaken using Fourier transform infrared spectroscopy (FT-IR), thermo-gravimetric analysis (TGA), X-ray diffraction (XRD), field emission scanning electron microscopy (FE-SEM) and the ball mill. The results showed that the Ni-plated PS microspheres were successfully prepared. The PS microspheres copolymerized with the silane bridging agent contain more binding sites for Ni, and the bonds formed with Ni are stable. The distribution of Ni-plating on the PS microspheres is more uniform and denser in the presence of TSPM. In ball mill, the Ni-plated PS microspheres containing silane bridges were more durable than those without silane bridges. Polymer Journal (2016) 48, 91–99; doi:10.1038/pj.2015.88; published online 7 October 2015